Press Releases

Title Date

Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications

Santa Clara, Calif., February 18, 2021Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, and Logic Fruit, an R&D house focused on test and measurement (T&M) applications, announced today a partnership to provide optimized T&M IP solutions for the Speedster®7t FPGA devices.

Achronix to Exhibit 7nm FPGAs and eFPGA IP at SC20

Santa Clara, Calif., October 27, 2020Achronix Semiconductor Corporation, a leader in FPGA-based hardware accelerator devices and high-performance eFPGA IP, announces it will exhibit at SuperComputing (SC20), the International Conference for High-Performance Computing, Networking, Storage, and Analysis.

Mike Fitton, Achronix Sr. Director of Strategy and Planning, to Present at Linley Processor Conference

Santa Clara, Calif., September 24, 2020Achronix Semiconductor Corporation, a leader in FPGA-based data accelerator devices and high-performance eFPGA IP targeting AI, ML networking and data center applications, announces its participation in this year's Linley Fall Processor Conference.

Achronix Senior Director of Strategy and Planning Mike Fitton to Present at AI Hardware Summit

Virtual booth highlights hardware and IP solutions designed for artificial intelligence and machine learning applications

Santa Clara, Calif., September 17, 2020Achronix Semiconductor Corporation, a leader in high-performance FPGAs and eFPGA IP targeting AI, ML, networking and data center applications, announces its participation in the third annual AI Hardware Summit virtual event.  Achronix invites attendees to save on their registration fee by using coupon code ACHRONIX10 for a 10% discount.

Achronix to Exhibit at TSMC Worldwide Technology Symposiums and OIP Ecosystem Forums

Santa Clara, Calif., August 12, 2020Achronix Semiconductor Corporation, a leader in FPGA-based data accelerator devices and high-performance eFPGA IP targeting AI, ML networking and datacenter applications, announces its participation in this year's TSMC Technology symposium and OIP ecosystem forum.