Newsroom

Title Date
Achronix To Participate at the Oppenheimer Technology, Internet & Communications Conference on August 8

Santa Clara, CA – July 25, 2023 – Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that President and CEO, Robert Blake, and CFO, Mahesh Karanth, will participate at the Oppenheimer Technology, Internet & Communications Conference on August 8, 2023.

Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs

San Jose, Calif., June 12, 2023 – Achronix Semiconductor Corporation, a global leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, is thrilled to announce that the Achronix Network Infrastructure Code (ANIC) includes 400 Gigabit Ethernet (GbE) connectivity.

Achronix VectorPath Accelerator Card Achieves PCIe 5.0 ×16 Compliance at 32 GT/s

Santa Clara, Calif., May 22, 2023 – Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that its VectorPath accelerator card featuring a Speedster®7t FPGA has received PCIe 5.0 ×16 compliance at 32 GT/s and is the first and only FPGA-accelerated CEM add-in card on the PCI-SIG integrator's list that has achieved this level of performance.

Achronix to Participate at the Oppenheimer Emerging Growth Conference on May 11

Santa Clara, Calif., May 2, 2023 – Achronix Semiconductor Corporation, a leader in high-performance field-programmable gate arrays (FPGAs) and embedded FPGA (eFPGA) IP, today announced that President and CEO, Robert Blake, and CFO, Mahesh Karanth, will participate at the Oppenheimer 8th Annual Emerging Growth Conference on May 11, 2023, which will be held as a virtual event.

Fraunhofer IIS/EAS Selects Achronix Embedded FPGAs (eFPGAs) to Build Heterogeneous Chiplet Demonstrator

Santa Clara, Calif., and Dresden, Germany, April 25, 2023 – In a continuing commitment to enabling industry-leading solutions for the semiconductor market, Fraunhofer IIS/EAS, leading-edge applied research institute in the field of advanced package solution design, and Achronix Semiconductor Corporation, are entering today in a partnership to build a heterogeneous chiplet solution to validate performance and interoperability in advanced high-performance system solutions.