September 26, 2019 : Santa Clara, CA

Achronix will be exhibiting at the TSMC 2019 North America Open Innovation Platform Forum on Wednesday, September 26, 2019 in Santa Clara, CA. The forum runs from 8:00 AM – 6:30 PM

Come visit us at booth #420 to learn more about how Speedcore embedded FPGA (eFPGA) IP has brought the power and flexibility of programmable logic to ASICs and SoCs. Customers can integrate a Speedcore eFPGA into an SoC for high-performance, compute-intensive and real-time processing applications such as AI, machine learning, 5G wireless, networking and automotive.

TSMC 2019 NA OIP Ecosystem Forum will be held at

Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054

For more info, visit www.tsmc.com/Event/2019_NA_OIP.

ACHRONIX ANNOUNCEMENTS

Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance

ACHRONIX ANNOUNCEMENTS

Achronix Demonstrates Silicon Validation Device with 112 Gbps SerDes